SiP Process Engineer

Position Summary

We are seeking an experienced SiP (System-in-Package) Process Engineer to develop, qualify, transfer, and optimize assembly processes from prototype through high-volume manufacturing. The role focuses on product quality, yield improvement, and resolving manufacturing issues in collaboration with Design, Package Engineering, Equipment, Quality, Reliability, and Manufacturing teams.

Key Responsibilities

• Develop and optimize SiP assembly processes for multi-die and heterogeneous integration products.
• Establish process flows, parameters, specifications, and control plans.
• Support die attach, flip chip, wire bonding, SMT and component placement, underfill, molding, singulation, laser marking, shielding, and rework processes.
• Lead engineering builds, design of experiments (DOE), process characterization, and qualification.
• Review package and product designs for manufacturability and assembly feasibility (DFM/DFA).
• Support new product introduction and transfer from R&D or pilot production to mass manufacturing.
• Analyze process and yield data, identify root causes of defects, and implement corrective actions.
• Evaluate new materials, equipment, and process technologies for SiP applications.

Required Qualifications

• Bachelor's or Master's degree in Electrical, Mechanical, Materials, Electronics, or Chemical Engineering, or a related field.
• Typically 3–8+ years of semiconductor packaging, assembly, or SiP process engineering experience, depending on level.
• Hands-on experience with semiconductor packaging and assembly processes.
• Understanding of manufacturing process control.
• Experience with DOE, SPC, FMEA, 8D, root-cause analysis, and statistical analysis.
• Ability to connect process parameters with product performance.
• Strong technical problem-solving and communication skills.

Preferred Experience

Experience in one or more of the following: SiP, multi-chip modules, heterogeneous integration, chiplet packaging, 2.5D/3D packaging, flip chip, wire bonding, die attach, SMT, fan-out packaging, package-on-package, embedded die technologies, RF SiP, automotive SiP, MEMS packaging, or advanced IC packaging.